Profile

Yong Chen (Nick) received the B.Eng. degree in electronic and information engineering, Communication University of China (CUC), Beijing, China, in 2005, and the Ph.D. in Engineering degree in microelectronics and solid-state electronics, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China, in 2010.

From 2010 to 2013, he worked as Post-Doctoral Researcher in Institute of Microelectronics, Tsinghua University, Beijing, China. From 2013 to 2016, he was Research Fellow responsible for high-speed (40+Gb/s) wireline communication and Low Energy Electronic Systems (LEES) project under the Singapore-MIT Alliance for Research and Technology (SMART) on RF CMOS transceiver in VIRTUS/EEE, Nanyang Technological University, Singapore. He is now an Assistant Professor of the State Key Laboratory of Analog and Mixed-Signal VLSI (AMSV) of University of Macau, Macao, China, since March 2016.

His research interests include integrated circuit designs involving analog/mixed-signal/RF/mm-wave/sub-THz/wireline.

Dr. Chen was the recipient of the "Haixi" (three places across the Straits) postgraduate integrated circuit design competition (Second Prize) in 2009, the co-recipient of the Best Paper Award at the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) in 2019 and the co-recipient of the Macao Science and Technology Invention Award (First Prize) in 2020. His team reported 3 chip inventions at the IEEE International Solid-State Circuits Conference - ISSCC (Chip Olympics): mm-wave PLL (’19) and VCO (’19), and radio-frequency VCO (’21).

Dr. Chen serves as an Associate Editor of IEEE Transaction on Very Large Scale Integration (TVLSI) Systems since 2019, an Associate Editor of IEEE Access since 2019, an Associate Editor of IET Electronics Letters (EL) since 2020, an Editor of International Journal of Circuit Theory and Applications (IJCTA) since 2020 and a Guest Editor of IEEE Transactions on Circuits and Systems II: Express Briefs in 2021. He serves as a Vice-Chair of IEEE Macau CAS Chapter (’19-’21), a Tutorial Chair of ICCS (’20), a conference local organization committee of A-SSCC (’19), a member of IEEE Circuits and Systems Society, Circuits and Systems for Communications (CASCOM) Technical Committee (’20-’21), a member of Technical Program Committee (TPC) of A-SSCC (’21), APCCAS (’19-’20), ICTA (’20-’21), NorCAS (’20-’21) and ICSICT (’20), a Review Committee Member of ISCAS (’21), and a TPC Co-Chair of ICCS (’21).