Profile

Kaya Demir received the B.S. degree in electrical engineering from Bilkent University, Ankara, Turkey, and the Ph.D. degree in electrical engineering from the Georgia Institute of Technology, Atlanta, GA, USA, where he was a Research Fellow with 3-D Systems Packaging Research Center. He was a Process Engineer with Maxim Integrated, Dallas, TX, USA. His Ph.D. research focused on modeling, design, fabrication, and reliability characterization of through-package-vias in glass interposers for 3-D packaging. His research interests include IC design, random number generators and micro-fabrication technologies. He is currently a senior researcher at TÜBITAK, Bilgem Informatics and Information Security Research Center located in Kocaeli, Turkey.