Profile

Fengshi Tian was born in Henan, China, in 1999. He received B.Eng. degree in microelectronics science and engineering from Fudan University, Shanghai, China, in 2021. He is currently pursuing the Ph.D. degree in electronic and computer engineering at The Hong Kong University of Science and Technology (HKUST), Hong Kong SAR, China. His current research interests include neuromorphic computing for intelligent biomedical applications, energy-efficient deep learning algorithm & VLSI architecture co-design and CIM implementation for emerging AI processors.