In recent years, there is substantial demand for scaling computing and memory capacity. Silicon interconnect fabric (Si-IF) promotes a paradigm shift in packaging features and enables ultra-large-scale systems. Such systems are expected to dissipate tens of kilowatts of power. Designing an efficient and robust power delivery methodology for these high-power applications is a key challenge. Based on several figure-of-merit parameters, an efficient power delivery methodology is matched with three candidate applications on the Si-IF, namely, artificial intelligence accelerators, high-performance computing, and neuromorphic computing. The proposed power delivery approaches were simulated and exhibit compatibility with the relevant ultra-large-scale application on Si-IF.