Profile

Shi Bu received the B.Eng. and M.Phil. degrees in electronic engineering from The Chinese University of Hong Kong, Hong Kong, in 2014 and 2016, respectively, and the Ph.D. degree in electrical and computer engineering from the University of California, Los Angeles, CA, USA, in 2021.

In 2021, he was an Intern at Qualcomm Technologies, Inc., San Diego, CA, USA. He is currently with Broadcom Inc., Irvine, CA, USA. His research interests include analog, mixed-signal, and RF integrated circuits for communication and power-management applications.