Profile

Ravinder Dahiya is a Professor of Electronics and Nanoengineering at the University of Glasgow. His group (Bendable Electronics and Sensing Technologies (BEST)) conducts fundamental research on high-mobility materials based on flexible electronics leading to electronic skin and their application in robotics and wearable systems. Prof. Dahiya has published more than 280 research articles, 4 books, and 15 patents submitted/granted. He has given more than 140 invited/plenary talks. He has led many international projects (~ £30M) funded by the European Commission, EPSRC, The Royal Society, The Royal Academy of Engineering, and The Scottish Funding Council. He is Fellow of IEEE, President-Elect (2020-21) and Distinguished Lecturer of the IEEE Sensors Council. He is serving on the editorial boards of several leading journals. He holds EPSRC Fellowship and received in past the Marie Curie Fellowship and Japanese Monbusho Fellowship. He also received the 2016 IEEE Sensor Council Technical Achievement Award and the 2016 Microelectronic Engineering Young Investigator Award (Elsevier).