Profile

Pengcheng Xu (IEEE member) received the bachelor’s degree (Hons.) in physics from Shanghai Normal University, Shanghai, China, in 2013, the master’s degree (Hons.) in integrated circuit engineering from Tongji University, Shanghai, in 2016, and the Ph.D. degree in electrical engineering from the Université catholique de Louvain (UCLouvain), Louvain-la-Neuve, Belgium, in 2021. In 2015, he was an Exchange Student with the University of Erlangen-Nuremberg, Erlangen, Germany.

From February 2017 to November 2020, he was a Research Assistant in electrical engineering with UCLouvain. Since November 2020, he has been a Research Associate with the Department of Circuits and Systems, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT, Munich, Germany. He was the Holder of the Chinese National Scholarship three times. He has authored or coauthored nine technical articles, including JSSC, IEEE International Solid-State Circuits Conference (ISSCC), and IEEE Asian Solid-State Circuits Conference (ASSCC). He holds one delivered European patent. His research area includes analog and mixed-signal integrated circuit design.

Dr. Xu is also a Member of IEEE Solid-State Circuits Society (SSCS). He was a recipient of the Shanghai Outstanding Graduates Student Award in 2013 and 2016, the Meritorious Winner in the 2013 Mathematical Contest in Modeling of America (MCM) and Chinese government award for outstanding self finance students abroad in 2020. He also serves as a Reviewer for various journals and conferences, such as the IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I/II, IEEE WIRELESS COMMUNICATIONS LETTERS, and IEEE ACCESS. He is a TPC member of 2022 IEEE Design Automation Conference (DAC).