A linear amplifying circuit with high voltage, high slew rate and wide bandwidth is presented in this paper. The circuit topology is by dividing the amplifier circuit into three chips and applying different substrate voltage to each chip so that the amplifier's maximum output voltage can achieve almost twice the withstand voltage. The circuit is verified with a 200V 0.25-um SOI-LDMOS process technology . The experimental result shows that the maximum output voltage can achieve 425 Vpp with the Slew rate of 1120 V/us and bandwidth of 2.3 MHz. The multi-chips hybrid amplifier is expected to be used for many industrial applications.